DiaTherm brings CVD diamond, the most thermally conductive material known, into semiconductor packages. We supply diamond heat spreaders and are developing the bonding process that gets heat out of the chip without trapping it at the interface.
Power electronics, AI accelerators and 3D-stacked chips concentrate more power into less area every generation. Copper and ceramic heat spreaders are reaching their ceiling, and hot spots throttle performance and shorten device life.
Typical room-temperature thermal conductivity. Values vary by grade and process.
Diamond only helps if the heat can actually reach it. Our work focuses on the full path from chip to spreader.
Heat spreaders and wafers sourced through a direct manufacturing network with large-scale CVD growth capacity, qualified to application requirements.
A bonding process under development in Dresden that minimises voids and interface resistance, so heat is not trapped between die and diamond.
Characterisation and integration work with research partners, including diamond for thermal management in 3D semiconductor structures.
SiC and GaN modules for EVs, chargers and grid infrastructure.
High-power accelerators where heat density limits clock speed and rack density.
Chiplets, SiP and 3D stacks with buried hot spots that conventional spreaders cannot reach.
GaN RF amplifiers and laser diodes that need compact, highly conductive heat paths.
DiaTherm combines materials research, semiconductor integration and a direct CVD diamond supply network, working closely with research partners in Europe's largest microelectronics cluster.
We are looking for pilot partners, researchers and packaging engineers who are hitting thermal limits today. We would love to hear what you are seeing.